The cold plates meet the high requirements of modern power electronics and have been specially developed for the latest SiC, GaN or IGBT power modules. Wide bandgap electronics is optimized to operate at higher switching frequency, higher temperature in a much more compact design.
Mersen has developed IsoMAXX - a revolutionary vacuum-brazed cold plate with unique properties for the new requirements that would overwhelm conventional cooling solutions.
The average thermal resistance (Rth) is as low as 6 °C/kW and the ~600 mbar pressure drop is substantially lower than that of all previous models. IsoMAXX cold plates ensure an optimal temperature range for power electronics, in which all single chips and modules on the cold plate remain at the same temperature. It also helps development engineers to design solutions with increased efficiency and a minimal footprint: no minimum clearance is required between modules, which allows versatile integration regardless of the number of modules needed for the particular application.